eccostock?sh rigid high temperature plastic foam sheet stock rigid plastic foam sheet stock eccostock sh is a rigid polyurethane foam, which re mains rigid and withstands high temperatures, for a short time even up to 163c (325f). unlike most po lyurethanes, eccostock sh has an extremely low dissipation factor and low dielectric constant. it is a closed cell foam, pink in color. features and benefits ? rigid ? high temperature resistance markets ? commercial telecom ? security and defense specifications typical properties eccostock sh bulk density, lbs/ft3 (g/cc) 2 (0.03) 8 (0.13) 14 ( 0.22) temperature range c (f) -70 to 135 (-94 to 275) -70 to 135 (-94 to 275) -70 to 135 (-94 to 275) dielectric constant (1 mhz) 1.04 1.12 1.25 dielectric strength, volts/mil 40 40 40 dissipation factor (1 mhz) 0.001 0.002 0.005 compressive strength, psi (kg/cm2) 30 (2.1) 250 (17.6) 600 (42.3) flexural strength at 5% strain, psi (kg/cm2) 25 (1.8) 225 (15.8) 800 (56.0) flexural modulus, psi (kg/cm2) 500 (35.2) 7,000 (493) 20,000 (1408) tensile strength, psi (kg/cm2) 40 (2.8) 200 (14.1) 450 (31.7) shear strength, psi (kg/cm2) 35 (2.5) 140 (9.9) 300 (21.1) coefficient of thermal expansion per c 25 x 10 - 6 40 x 10 - 6 50 x 10 - 6 water absorption, % gain in 24 hours 3 1.5 1 data for design engineer guidance only. observe d performance varies in application. engineers are reminded to test the material in application. applications ? eccostock sh is primarily used as a high-temperatur e structural member or thermal barrier in electrical/electronic applications. availability ? standard sheets are 30.5 x 61 cm (12 x 24) in th icknesses of 2.5 cm, 5 cm, 7.6 cm, 10 cm & 15 cm (1, 2, 3, 4 & 6). ? it is available in bulk densities of 2, 4, 6, 8, 10 , 12, & 14 lbs/ft3 (0.03, 0.06, 0.10, 0.13, 0.16, 0 .19 & 0.22 g/cc). ? eccostock sh is available in other thicknesses, siz es, and customer specified shapes upon request. americas: +1.866.928.8181 europe: +49.(0)8031.2460.0 asia: +86.755.2714.1166 www.lairdtech.com
eccostock? sh rfp-ds-sh 112515 a ny information furnished by laird technologies, inc . and its agents is believed to be accurate and rel iable. all specifications are subject to change wit hout notice. responsibility for the use and applica tion of laird technologies materials rests with the end user. laird technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any laird technologies materials or products for any specific or general uses. laird technologies s hall not be liable for incidental or consequential damages of any kind. all laird technologies products are sold purs uant to the laird technologies terms and condition s of sale in effect from time to time, a copy of wh ich will be furnished upon request. ? copyright 201 5 laird technologies, inc. all rights reserved. lai rd, laird technologies, the laird technologies logo, and othe r marks are trademarks or registered trademarks of laird technologies, inc. or an affiliate company th ereof. other product or service names may be the pr operty of third parties. nothing herein provides a license under any laird technologies or any third party int ellectual property rights. instructions for use ? eccostock sh at densities less than 3 lbs/ft3 (0.05 g/cc) may warp at temperatures above 93c (200f). ? unicellularity: not interconnected above 6 lbs/ft3 (0.10 g/cc). however, below this density there is a significant percentage of cells connected. ? eccostock sh is easy to machine. related products ? eccostock? fph: high temperature foam-in-place cast ing resin with available bulk density depending on catalyst and mold design. when cured, it has ident ical properties to eccostock sh of the same bulk density. (eccostock sh is produced from eccostock? fph under precisely controlled laboratory conditions.)
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